INDUSTRIAL COMPONENTS

Memory

FLASH DATA/NAND

STD 1.8-3.0V STD 5.0V DATA/NAND LPC/FWH MCP FLASH+SRAM Manufacturer Density Partnumber Speed MHz Package (Pin/Ball count) Voltage (Vcc) Organisation Temp. Range Atmel 512 Kbit AT25F512 20 8 SOIC 2.7-3.6 V serial; SPI C;I Atmel 1 Mbit AT25F1024 20 8 SOIC 2.7-3.6 V serial; SPI C;I Atmel 1 Mbit AT45DB011 20 8 SOIC/9 BGA/14 TSSOP 2.7-3.6 V serial; SPI C;I Atmel 2 Mbit AT25F2048 20 8 SOIC 2.7-3.6 V serial; SPI C;I Atmel 2 Mbit AT45DB021 20 8 SOIC/9 BGA/28 SOP/28 TSOP 2.7-3.6 V serial; SPI C;I Atmel 4 Mbit AT45DB041 20 8 SOIC/9 BGA/28 SOP/28 TSOP 2.5-3.6 V serial; SPI C;I Atmel 8 Mbit AT45DB081 20 8 Cason/14 BGA/28 SOP/28 TSOP 2.5-3.6 V serial; SPI C;I Atmel 16 Mbit AT45DB161 20 8 Cason/24 BGA/28 SOP/28 TSOP 2.5-3.6 V serial; SPI C;I Atmel 32 Mbit AT45DB321 20 28 SOP/32 TSOP/44 BGA 2.7-3.6 V serial; SPI C;I Atmel 64 Mbit AT45DB642 20 (seriell) 5 (parallel) 40 TSOP 2.7-3.6 V serial; SPI/parallel C;I Atmel 128 Mbit AT45DB1282 40 (seriell) 20 (parallel) 40 TSOP/44BGA 2.7-3.6 V serial; SPI, parallel C;I Atmel 256 Mbit AT45DB2562 Information available under NDA Samsung 64 Mbit K9F6408U0C 50 ns 44 TSOP 2.7-3.6 V 8 Mx8 C;I Samsung 128 Mbit K9F2808U0C 50 ns 48 TSOP 2.7-3.6 V 16 Mx8 C;I Samsung 256 Mbit K9F5608U0C 50 ns 48 TSOP 2.7-3.6 V 32 Mx8 C;I Samsung 512 Mbit K9F1208U0A 50 ns 48 TSOP 2.7-3.6 V 64 Mx8 C;I Samsung 1 Gbit K9F1G08U0M 50 ns 48 TSOP 2.7-3.6 V 128 Mx8 C;I Samsung 1 Gbit K9K1G08U0A 50 ns 48 TSOP 2.7-3.6 V 128 Mx8 C;I Samsung 2 Gbit K9K2G08U0A 50 ns 48 TSOP 2.7-3.6 V 256 Mx8 C;I Samsung 4 Gbit K9W4G08U1M 50 ns 48 TSOP 2.7-3.6 V 512 Mx8 C;I SST 512 Kbit SST25VF512 20 8 SOIC/WSON 2.7-3.6 V serial; SPI C;I SST 1 Mbit SST25VF010 20 8 SOIC/WSON 2.7-3.6 V serial; SPI C;I SST 2 Mbit SST25VF020 20 8 SOIC/WSON 2.7-3.6 V serial; SPI C;I SST 4 Mbit SST25VF040 20 8 WSON 2.7-3.6 V serial; SPI C;I SST 8 Mbit SST25VF080 20 8 SOIC/WSON 2.7-3.6 V serial; SPI C;I SST 16 Mbit SST25VF016 20 8 WSON 2.7-3.6 V serial; SPI C;I Industrial Components Contact