Issue 01/2012

Today's Topics

Embedded World 2012 in Nuremberg, 28th February – 1st March

In a few days the embedded world 2012, the international meeting place for the embedded community will open in Nuremberg.
MSC will present its full range of latest innovations and developments in the field of embedded technologies.


COM Express Module with cost and power efficient 32 nm Celeron

Our powerful MSC CXB-6S COM Express ™ module family based on second generation Intel® Core™ processors has been expanded with two cost-efficient Intel®  Celeron® CPU variants. The new boards almost reach the pricing level of Intel® Atom™ and ARM® based solutions.

The new embedded modules integrate the Intel® HM65 PCH chipset and the Intel®  Celeron® processor 827E with one core (1.4GHz) or the dual-core Intel®  Celeron®  processor 847E with 1.1GHz clock frequency. Both processors use a 2 MB Level-3 cache. The specified thermal dissipation power (TDP) of both processors is 17W. The typical power consumption of the 827E based module is below 20W. Even more power-efficient is the shortly available COM Express ™ module with  Intel®  Celeron® processor 807E which consumes 10W (TDP) only.

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You will find us in Hall 2, Booth 219

As every year MSC Vertriebs GmbH will present many innovations out of various product ranges.

MSC Embedded Computer Technology will show a wide variety of products in the following form factors:

  • COM Express ™
  • Qseven ™
  • nanoRISC ®
  • ETX ®
  • EXM32
  • Industrial mainboards

Product introductions:

MSC Q7-A50M, based on the AMD G-Series T40E or T40R low-power processors with excellent graphics power.

MSC Q7-TI8168, based on the TI C6-Integra MPU, a powerful combination of an ARM Cortex-A8 and a DSP.

MSC CXB-6SI, a COM Express module with quad-core processors of the newest generation.

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COM Express Module MSC CXB-6S



  • Processor choice:
    Intel® Celeron® 827E (single core, 1.4GHz, 17W TDP),
    Intel® Celeron® 847E (dual core, 1.1GHz, 17W TDP),
    Intel® Core™ i5-2515E (dual core, 2.5GHz, 35W TDP),
    Intel® Core™ i7-2610UE (dual core, 1.5GHz, 17W TDP),
    Intel® Core™ i7-2655LE (dual core, 2.2GHz, 25W TDP),
    Intel® Core™ i7-2715QE (quad core, 2.1GHz, 45W TDP)
  • Intel® HD Graphics 2000 / 3000
  • Intel® QM67 oder HM65 PCH
  • Up to 2x 8GB DDR3 SDRAM, dual channel
  • Four SATA-300 mass storage interfaces
  • One Enhanced IDE Port
  • 10/100/1000 Base­TX Ethernet interface
  • LVDS Interface (24 Bit, dual channel)
  • CRT interface
  • Resolution up to 2560 x 1600
  • Dual Independent Display supported
  • PCI Express™ x16 (PEG) support
  • DisplayPort™ and HDMI support (over PEG)
  • Five PCI Express™ x1 lanes
  • Eight USB 2.0 interfaces
  • HD audio interface
  • Infineon TPM 1.2
  • UEFI Firmware
  • System monitoring, watchdog
  • ACPI power management
  • COM Express ™ Type 2 compliant
  • “Basic” form factor (125 x 95 mm)
  • Windows® 7, Vista, XP (embedded) and Linux supported

When it comes to highest demands for computing, graphics or video performance, the new modules will show their strength. They will be best suited for applications in the fields of image processing, medical engineering, casino gaming or for high resolution digital signage..
More information.... 

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Further information on our COM products is available on or in our Embedded and Industrial Products Guide [4 MB].
If you are interested in our products, please contact your regional MSC sales manager or send an email to

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