17/05/2013
Rugged test system of Yamaichi for COM Express modules ...
In many production facilities the regular main board is used for testing of
COM Express modules. The modules are plugged into the usual COM Express
connectors. Due to the limited number of mating cycles of the COM Express
connectors, the main boards have to be replaced after 30 to 40 test cycles. T ...
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| 17/05/2013
Elektor, MSC & Lattice Quick Starter Design Training ...
The "Quick Starter Design Training" is aimed at newcomers to the FPGA Design,
switching from ispLever SW to SW Diamond as well as hardware and software
developers. Taught topics are project development and design flow, design entry,
generation of IP cores, simulation, constraining, place and route, ...
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23/04/2013
New XLamp
XQ LEDs from Cree ...
Stutensee (Germany) - The new product family of Cree LED XQ is now available
to purchase via MSC. It is specially designed for applications with a wide-angle
light scattering. These include lights and lamps which emit light in all
directions. ...
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| 15/04/2013
New generation SSD SM843T from Samsung ...
The SM843T is available from 120 GB to 960 GB. The sophisticated version with
960 GB SSD Power Loss function is placed on the market for the first time. It
also impresses with enormous TBW (Total Written byte) values: 2PByte to 120GB,
up to 240GB 4PByte, 480GB and 960GB up to 8PByte 16PByte. These h ...
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11/04/2013
New RX100 Series MCUs from Renesas ...
The RX100 Series MCUs, which are based on the proven 130 nm, low-power
process technology, are suitable for use in various price-sensitive, low-power
applications such as instrumentation, medical and sensor products. The new MCUs
can run at 32 MHz, delivering 1.56 DMIPS/MHz throughput. With 8 KB to ...
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| 09/04/2013
The new Lite+ TFT-LCDs from KOE Europe ...
The 5-inch (12.7 cm) TX13D06VM2BAA in one of the first Lite+ display modules
to be introduced by KOE. The TX13D06VM2BAA with WVGA (800 x 480 pixels)
resolution has mechanical outline dimensions of 120.0 mm x 80.7 mm x 8.0 mm and
features a brightness of 1000 cd/m² and a 500:1 contrast ratio. The ind ...
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02/04/2013
SiTime’s new SiT15xx family ...
The new MEMS oscillators are currently available in three different models:
the SiT1532/42 in a 1.5 mm x 0.8 mm chip scale package (CSP), the SiT1534/44 in
a 2.0 mm x 1.2 mm package that is pin-compatible with quartz resonators and the
SiT1534/44 that support frequencies from 1 Hz to 32.768 kHz and ...
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15/03/2013
DC/DC power supplies by Aimtec with RCC topology ...
The input voltage range of the DC/DC converters is programmable between 4.5
to 72 VDC with a ratio of either 2:1 or 4:1. Single or dual output voltage
choices range from 3.3 to 24 VDC with input/output isolation of either 1.5 kV DC
or 3.5 kV DC. Additional features of these DC/DC power supply module ...
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| 10/03/2013
Workshop „Connected World = Wireless World“ ...
Stutensee (Germany) - The MSC RF/Wireless Team in cooperation with its
partners Panasonic and H&D Wireless would like to invite you to a special
Workshop with the latest updates on technologies for home, industry and medical
applications. Our specialists will inform you about Wireless Technologies f ...
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22/02/2013
16 kbit FRAM by Fujitsu in space-saving SON-8 package ...
Stutensee (Germany) – MSC now offers the addition of a new smaller package to
the MB85RC16, 16 Kbit Ferroelectric Random Access Memory (FRAM), from Fujitsu
Semiconductor Europe (FSEU). The new 16 kbit FRAM features ultra low-power
consumption. The package dimension of the MB85RC16 is just 3 mm x 2 m ...
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19/02/2013
A Lot of DIAMOND Lattice ECP3 for a Small Price ...
Stutensee (Germany) - Lattice (Distributor: MSC Vertriebs) starts the ECP3
“Re-surge”-campaign. The promotion is valid until 04 September 2013. The
one-year license Lattice Diamond, the ECP3 Versa Development Kit or each of five
IP Suites can be purchased for each $ 99. No chance to get ECP3 develop ...
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| 07/02/2013
100Gbps High-Speed CFP2 Connector and Components by Yamaichi ...
Stutensee (Germany) - The new CFP2 connectors (series title CA009) by
Yamaichi, which is now available at MSC convinces with 100Gbps high-speed data
transfer and met first the fully MSA requirements.
The pitch of the CFP, from 0.8 mm for the CFP2 was reduced to 0.6 mm and thus
achieves a data trans ...
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| 24/01/2013
MSC presents new nanoRISC® Processor Module with TI AM335x ...
Initially, two processors from TI’s AM335x family will be used for the
nanoRISC-AM335x module. The AM3352 clocked at 300MHz with its very low power
consumption and basic feature set will mark the economic entry-level module,
while the AM3354 at 800MHz will provide very high computing power as well ...
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| 07/01/2013
New connector for LED applications by JST ...
Unevenness in the circuit boards are compensated by thermal expansion (series
LEB / LEL) and a reliable locking mechanism prevents accidental release or an
incomplete connection of the system (LEA Series).
In the series LEL (Wire to Wire) gold plated contacts provide extra long life of
LED lightin ...
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