NEWSLETTER

We will inform you about news and products:  COM Express, ETE/ETX, Qseven and EXM32.

2012

• Starter Kit for Designs with COM Express Type 6 Pin-out ...
• 3rd Generation Intel® Core™ Processors on COM Express Modules ...
• Starter Kits for our COM Module Families ...
• Embedded World 2012 in Nuremberg, 28th February – 1st March ...

2011

• Now on YouTube: New Celeron Processors on COM Express Modules ...
• Invitation to SPS/IPC/DRIVES 2011 in Nuremberg, 22th – 24th November 2011  ...
• nanoRISC® Family of RISC-based Processor Modules is Available  ...
• * MSC Embedded Computer Technology opens Sales Office in the USA ...
• COM Express Module with new 32 nm Celeron – the Cost-Efficient Flagship ...
• MSC Joins Intel’s Embedded Building Blocks Initiative ...
• New Product Brochure „EMBEDDED COMPUTER TECHNOLOGY – Edition 2011“ ...
• COM Express Module with new Quad and Dual Core Processors  ...
• * Embedded World 2011 in Nuremberg, 1st – 3rd March  ...
• MSC Supports New Qseven ™ Specification 1.20 ...

2010

• Baseboard with CAN for Qseven™ Systems  ...
• Invitation to SPS/IPC/DRIVES 2010 in Nuremberg, 23th – 25th November 2010  ...
• Compact COM Express™ Module with Intel® Atom™ Dual Core CPU ...
• New Atom™ Processor Models for MSC’s ETX™ Module Family ...
• Two Gigabyte Memory on Ultra Compact Qseven™ Modules ...
• Latest ETX Modules are Going to Replace Obsolete Technologies ...
• Optimized COM Express Cooling Solutions allow 60°C Ambient Temperature ...
• MSC Presents Modular Embedded Platform for Digital Signage Applications ...
• MSC expands its ETX™ module family with Intel® Dual Core Atom™ version ...
• New Product Brochure ...
• * Embedded World 2010 in Nuremberg, 2nd – 4th  March ...
• COM Express™ Modules for Challenging Applications ...

2009

• Baseboard for Efficient Development of Qseven Systems ...
• Invitation to SPS/IPC/DRIVES 2009 in Nuremberg, 24th – 26th November 2009   ...
• Qseven™ Evaluation Kit with Intel® Atom™ ...
• First COM Express Module based on Intel Dual Core Celeron CPU ...
• Highly Integrated EXM32 Module with Video Decoder, MOST and CAN ...
• New ultra compact Qseven Modules ...
• MSC expands its ETX™ module family with Intel® Atom™ CPU version ...
• Range of Starter Kit Products Growing Steadily ...
• First COM Express™ Module with Dual Channel DDR3 Memory Offers Highest Graphics and Computing Perfor ...
• * Invitation to Embedded World 2009 in Nuremberg, 3rd - 5th March ...
• Off-the-shelf COM Express baseboard for industrial systems in Mini-ITX form factor ...

2008

• Intel Atom Processor on the New Ultra Compact Module Standard Qseven ...
• * Invitation to SPS/IPC/DRIVES 2008 in Nuremberg, 24th – 27th November 2008  ...
• Simply exchange to save energy and reduce cost with Intel’s Atom™ ...
• Compact GS45 COM Express™ Module with great selection of processors provides highest computing power ...
• COM Express Module Offers Five PCI Express Interfaces ...
• ETX® Module based on VIA Chipset now supporting TTL flat panel displays ...
• Active and Passive Cooling Solutions for COM Modules ...
• Low-power COM Express Module based on Intel® Pentium® M and Celeron® M Processors ...
• COM Express Modules based on power-saving ULV Processor ...
• Navigation and communication module for extended temperature range ...
• All ETX® modules now also available with SATA interfaces ...

2007

• New Low-power ETX Module with two SATA Interfaces  ...
• Performance Jump for COM Express Module with Intel® Core™ 2 Duo Technology, 965GME Chipset and Dual ...
• CPU Module for Multimedia Applications with Improved Computing Performance in Extended Temperature R ...
• Extended choice of processors for ETX module with SATA and PATA interfaces ...
• High-end COM Express Module with Dual-Channel Memory Support ...