The cooling concept is based on a Heat-Spreader (Figure 1), a metal plate with direct thermal connection to the components consuming the bulk of the power. Customers can implement different cooling concepts through thermal connection to this Heat-Spreader.

In some cases a connection to the system housing might already provide sufficient heat dissipation, other applications might be better served with passive cooling elements that are exposed to the airflow inside the system.

High end applications with the highest power dissipation usually require active cooling directly on the COM module.

Figure 2 shows how the fan for these applications is mounted on top of the cooling device combining a high surface area with a guaranteed air flow.

A key factor for a reliable cooling solution is the thermal connection between the heat producing devices and the Heat-Spreader as well as between the Heat-Spreader an the cooling element. The following article 'Kühler Kopf für den Rechner' [german] discusses the different concepts for these thermal adaptions and the innovative solutions MSC offers.

For details and availability information for your specific cooling needs please contact your local sales representative or boards@msc-ge.com.