| Productinfo | Manufacturer | Type | Description | Product-Type | Product-Family | Publish Date | Effective Date | Last Time Buy | Request |
| | CC082901 [PDF64KB] | Atmel | PCN | Transfer of 6 and 7 mil Backgrind Operations to Atmel Philippines | Special/Divers | divers | 06.08.2008 | 06.11.2008 | | |
| | PCN_0674 [PDF30KB] | Hitachi | PCN | OPAMP IC change of vendor | Display | SP10xx | 05.08.2008 | 01.10.2008 | | |
| | HE083201 [PDF30KB] | Atmel | EOL | EOL of ATA5283P-6APJ and ATA5283P-6AQJ | Receiver | ATAxxx | 04.08.2008 | | 28.02.2009 | |
| | F-EOL-0039 [PDF37KB] | Macronix | EOL | EOL for MX29LV033C, 32Mb, 3V, Parallel Flash | FLASH | MX29xx | 01.08.2008 | | 14.08.2008 | |
| | CC082401 [PDF112KB] | Atmel | PCN | AT24C04 / AT24C04A / AT24C08A Automotive Product Layout Optimization and Conversion to NiPdAu Plating | EEPROM | AT24xx | 31.07.2008 | | 01.07.2009 | |
| SC083106 [PDF89KB]SC083106A [PDF86KB] | Atmel | PCN | Transfer of Parallel EEPROM (28 Series) Product Line to Pb-free and Halogen Free Packaging | EEPROM | AT28xx | 31.07.2008 | | 30.08.2008 | |
| SE083103 [PDF50KB]SE083103A [PDF36KB] | Atmel | EOL | EOL of the Industrial Grade Parallel EEPROM (28 Series) | EEPROM | AT28xx | 31.07.2008 | | 28.08.2008 | |
| P05500164 [PDF106KB]P05500164_Letter [PDF54KB] | SST | PCN | Transition from Revision B60 to B61 | FLASH | SST55xx | 30.07.2008 | 30.07.2008 | 31.10.2008 | |
| | SE083002 [PDF152KB] | Atmel | EOL | EOL of the leaded package for the AT29 memory devices | FLASH | AT29xx | 30.07.2008 | | 25.10.2008 | |
| | SE083101 [PDF43KB] | Atmel | EOL | EOL of the 28-lead and 32-lead PDIP packages of the Parallel EEPROM (28Series) | EEPROM | AT28xx | 30.07.2008 | | 28.08.2008 | |
| | PCN08072901 [PDF16KB] | Eon | PCN | Die description | FLASH | EN29xx | 29.07.2008 | 29.07.2008 | | |
| | SE082805 [PDF56KB] | Atmel | EOL | EOL for Select lead based Packages of AT94Kxx and the Secure AT94Sxx FPSLIC families | FPSLIC | AT94xx | 29.07.2008 | | 31.12.2008 | |
| P02500165_letter [PDF60KB]P02500165 [PDF50KB] | SST | PCN | Addition of Product Revision B and C at Power Chip fabrication facility | FLASH | SST25xx | 25.07.2008 | 25.07.2008 | | |
| | EOL-Bluetooth0708 [PDF26KB] | Panasonic | EOL | EOL of PAN1450 and PAN 1550 | Bluetooth | PAN 1450 PAN 1550 | 23.07.2008 | 24.07.2008 | 16.09.2008 | |
| | EOL08072302 [PDF60KB] | Eon | EOL | EN29F040A products will be phased out | FLASH | EN29xx | 23.07.2008 | 23.07.2008 | 31.01.2009 | |
| | EOL08072301 [PDF60KB] | Eon | EOL | EN29F002A products will be phased out | FLASH | EN29xx | 23.07.2008 | 23.07.2008 | 31.01.2009 | |
| | EOL_JLQG_0708 [PDF16KB] | Promate | EOL | EOLof JLQG150XG01N0-21 | Display | JLQxxx | 18.07.2008 | | 30.09.2008 | |
| | PCN_ETE-GLXx [PDF102KB] | MSC | PCN | Change of the AMD Geode LX800 (ETE-GLX-CPUxxx and ETE-GLX3-CPU500xxx) | COM | ETE/ETX | 17.07.2008 | 01.08.2008 | | |
| | SC081801 [PDF77KB] | Atmel | PCN | Gold Wire Diameter Reduction for SOIC (.150" and .208") and QFN/DFN for Serial Flash and Microcontroller Products
Gold Wire Diameter Reduction for SOIC (.150" and .208") and QFN/DFN for Serial Flash and Microcontroller Products | Special/Divers | divers | 15.07.2008 | 16.10.2008 | | |
| | PCN-54-34-00022 [PDF21KB] | SanDisk | PCN | will change the SSD 5000 2.5" SATA | FlashCard | SSD | 15.07.2008 | 15.08.2008 | | |
| | EOL_CRTtoLCD-7 [PDF122KB] | Kontron | EOL | EOL of CRTtoLCD-7 Multimedia | LCD | CRTtoLCDxxx | 15.07.2008 | | 31.12.2008 | |
| | CC082402 [PDF49KB] | Atmel | PCN | AT97SC3203 v1.2 TPM Version Change from 1.2.D.05 to 1.2.11.01 | Special/Divers | AT97xx | 14.07.2008 | | 31.12.2008 | |
| | CC082403 [PDF47KB] | Atmel | PCN | AT97SC3203S v1.2 TPM Version Change from 1.2.D.07 to 1.2.11.03 | Special/Divers | AT97xx | 14.07.2008 | | 31.12.2008 | |
| | CC082404 [PDF45KB] | Atmel | PCN | AT97SC3203 v1.2 TPM Version Change from 1.2.D.09 to 1.2.11.01 | Special/Divers | AT97xx | 14.07.2008 | | 31.12.2008 | |
| | EOL-0073708 [PDF62KB] | SanDisk | EOL | SanDisk will stop the support for SDMSM2N* and will ship the SDMSM* Version with ProDuo Adapter | FlashCard | SDM | 14.07.2008 | | 30.07.2008 | |
| | EOL_128Mb_Mobile_SDR_LVLP [PDF29KB] | Samsung | EOL | EOL of 128Mb mobile SDRAM 3V + 2.5V (K4M281633* / K4M28163L* / K4M283233* / K4M28323L*) | SDRAM | K4M | 10.07.2008 | | 30.09.2008 | |
| | RE082802 [PDF32KB] | Atmel | EOL | EOL of the AT91SAM7A2-AU and AT91SAM7A2-EK | Microcontroller | AT91xx | 09.07.2008 | | 20.01.2009 | |
| | NE082801 [PDF39KB] | Atmel | EOL | EOL of the 251 family of microcontrollers | Microcontroller | divers | 08.07.2008 | | 05.01.2009 | |
| | NE082701 [PDF63KB] | Atmel | EOL | EOL for the SND1/2/3 MP3 family | Microcontroller | divers | 07.07.2008 | | 05.01.2009 | |
| | EOL-54-34-00021 [PDF22KB] | SanDisk | EOL | SanDisk will stop the production of SSD 5000 1,8" UATA | FlashCard | SSD | 01.07.2008 | | 30.09.2008 | |
| | EOL_JP15 [PDF160KB] | Falcom | EOL | EOL of JP15 | GPS | JP15xxx | 30.06.2008 | 01.07.2008 | | |
| | EOL-54-34-00034 [PDF89KB] | SanDisk | EOL | SanDisk will stop the production of all FFD UATA and SATA | FlashCard | SSD | 30.06.2008 | 30.06.2008 | 30.09.2008 | |
| | PB1319 [PDF35KB] | Lattice | PCN | Change to EBR Modes Supported in FPGAs | FPGA | XP2 | 27.06.2008 | 27.06.2008 | | |
| | PB1320 [PDF35KB] | Lattice | PCN | Change to EBR Modes Supported in FPGAs | FPGA | ECP2/M | 27.06.2008 | 27.06.2008 | | |
| | PB1321 [PDF35KB] | Lattice | PCN | Change to EBR Modes Supported in FPGAs | FPGA | SC/M | 27.06.2008 | 27.06.2008 | | |
| | PDN0806 [PDF38KB] | Actel | EOL | Prototyping Adapter Board Inventory Simplification Notice | Hardware | divers | 27.06.2008 | 27.06.2008 | | |
| | CE082602 [PDF31KB] | Atmel | EOL | All Biometric FingerChip products and FingerChip Security Processor devices are being discontinued | Special/Divers | AT77xx | 27.06.2008 | | 31.12.2008 | |
| | PCN_dcul3_08 [PDF16KB] | F&S | PCN | F&S stoped the production of the DCUL3-/3C | LCD driver/controller | DCUxxx | 27.06.2008 | | | |
| | PCN_CXB-CD945 [PDF88KB] | MSC | PCN | change the Northbridge (CXB-CD945 and CXE-CD945) | COM | COM Express | 25.06.2008 | 01.07.2008 | | |
| | PDN1009-2008 [PDF50KB] | Renesas | EOL | EOL of HD64xxx | Microcontroller | HD64xx | 25.06.2008 | | 15.12.2008 | |
| | PDN1010-2008 [PDF16KB] | Renesas | EOL | EOL of MCU, MPP (HVU30xxx; HD64xxx) | Microcontroller | HD64xx | 25.06.2008 | | 15.12.2008 | |
| | PCN_0826 [PDF144KB] | ASI | EOL | EOL of 5C256x SRAM | SRAM | AS5C2568CWxx MT5C2561Cxx | 24.06.2008 | | | |
| | PDN0801 [PDF61KB] | Actel | EOL | PDN for CorePCI (-EV, -SR, -AR, -M, -RU) | Hardware | CorePCIxx | 23.06.2008 | 23.06.2008 | | |
| | WC082601 [PDF42KB] | Atmel | PCN | Addition of the ATMEL Rousset (FR) Wafer Fabrication Facility for ATmega16 Product Manufacturing | Microcontroller | ATMEGA | 23.06.2008 | | 23.09.2008 | |
| PCN084675 [PDF4KB]PCN084675_PQR [PDF119KB] | Cypress | PCN | Qualification of Millennium Microtech Thailand (MMT) as Alternative Assembly Site for LUPA 300 Image Sensor in 48 lead Ceramic LCC package | Image Sensors | LUPA 300 family | 21.06.2008 | | | |
| | PDN0804 [PDF16KB] | Actel | EOL | PDN for BG329 DAISY CHAIN, FG256 DAISY CHAIN, FG484 23X23 DAISY CHAIN, FG484X79 23X23 DAISY CHAIN and CG624 DAISY CHAIN BAE | Special/Divers | divers | 17.06.2008 | 17.06.2008 | | |
| | PCN-0073354 [PDF46KB] | SanDisk | PCN | Die-Shrink from 56nm to 43nm | FlashCard | SDSD | 17.06.2008 | | | |
| | PCN084673 [PDF7KB] | Cypress | PCN | Cypress will benefit by having a Green and Rohs compliant mold compound on the 32 lead TSOP 8x20mm package. | SRAM | CY62xx | 14.06.2008 | 14.06.2008 | | |
| P01200159 [PDF45KB]P01200159_letter [PDF39KB] | SST | PCN | Add second wafer foundry source (Torrance, USA) | Power | SST* | 09.06.2008 | 09.06.2008 | | |
| | PDN_2008-046 [PDF10KB] | IXYS | EOL | EOL of DSSK28-01A | Dioden/Rectifier | DSSxx | 06.06.2008 | 07.06.2008 | 31.08.2008 | |